Job responsibilities:
1. Product design stage: document and patent sorting, industry benchmark survey, TCAD simulation (including device structure and process flow simulation), etc.;
2. Product development stage: production process development, product experiment planning, etc.;
3. Product production stage: wafer processing and product packaging monitoring, etc.;
4. Product acceptance stage: product performance testing, failure analysis, etc.
Job skills:
1. Be proficient in the application of electronic technology, have a solid foundation of electronic circuits, and understand commonly used topologies;
2. Be proficient in the use of drawing software, and be familiar with MOSFET, IGBT and future third-generation semiconductor electronic products;
3. Have a solid foundation of analog circuits, digital circuits, circuit analysis, etc.;
4. Familiar with or understand the simulation tools and general processes used in the research and development of semiconductor devices;
5. Have TCAD simulation, wafer processing, and components Knowledge/experience related to device packaging and testing.
Recruitment target:
1. Educational requirements: major in microelectronics, electronics or semiconductor devices is preferred, working experience in related industries is also available, bachelor degree or above.
2. Candidates with relevant knowledge/experience in power semiconductor devices (such as diodes, MOSFETs, IGBTs, etc.) will be given priority;
3. With TCAD simulation, wafer processing, component packaging and Priority will be given to candidates who test relevant knowledge/experience.
4. Good writing skills, can record detailed problem handling skills and analysis methods. Able to work under pressure, full of team spirit;
5, good at learning, high sense of responsibility and professionalism, positive.